Support IBIS model, Hspice model and S-parameter model frequency domain,time domain, channel multiple simulation analysis methods, to ensure high-speed transmission performance comprehensive consideration of reflection, crosstalk, ringing, eye diagram, jitter, bit error rate, S-parameter DDR3, DDR3L, DDR4, PCIE, Serdes, SFP+ a large number of simulation cases, with rich practical experience

Electromagnetic compatibility includes electromagnetic interference EMC and electromagnetic sensitivity EMC. The board level EMC design adopts the idea of focusing on source control, taking countermeasures from the beginning of the design phase, and combining Signal integrity analysis, fundamentally solving the EMC problem. In boards with external interfaces and products that cannot be fully shielded, board level EMC design cannot be replaced by any other EMC measures. The consideration of EMC design in the aspect of single boards will reduce the pressure on subsequent processes and shorten the development cycle to reduce batch production costs.

Design for Manufacturability (DFM) is the process of considering factors such as manufacturability and assemblability during the design phase, in order to manufacture a product with the lowest cost, shortest time, and highest quality.