| Features | Technical Specifications |
| Number of layers | 1-4 layers |
| Technical highlights | Suitable for thermal applications effective cooling solution. This type of construction achieves excellent heat dissipation by using an aluminum or copper substrate bonded to an insulated circuit by a thermal prepreg or resin system. |
| Material | Aluminum & copper plate. FR-4, PTFE, heat dissipation dielectric layer. |
| Dielectric thickness | 0.05mm - 0.20mm |
| Thermal conductivity | |
| Forming method | Stamping, milling |
| Copper weight (finished) | 35μm - 140μm |
| Minimum line width and line spacing | 0.10mm / 0.10mm |
| Metal Core Thickness | 0.40mm - 3.20mm |
| Maximum Size | 550mm x 700mm |
| Surface treatment (applicable) | HASL with lead, HASL without lead, organic anti-oxidation, immersion gold, immersion tin, immersion silver< /td> |
| Minimum Mechanical Drilling | 0.30mm |
